Large Area Flexible Electronic Skin
Abstract: The miniaturization led advances in microelectronics over 50 years have revolutionized our lives through fast computing and communication. Recent advances in the field are propelled by applications such as robotics, wearable systems, and healthcare etc. through More than Moore technologies. Often these applications require electronics to conform to 3D surfaces and this calls for new methods to realize devices and circuits on unconventional substrates such as plastics and paper. This lecture will present various approaches (over different time and dimension scales) for obtaining distributed electronics and sensing components on flexible and conformable substrates, especially in context with tactile or electronic skin (e-skin). These approaches range from distributed off-the-shelf electronics, integrated on flexible printed circuit boards to advanced alternatives such as e-skin by printed nanowires, graphene and ultra-thin chips, etc. The technology for such sensitive flexible (and possibly stretchable) electronic systems is also the key enabler for numerous emerging fields such as internet of things, smart cities and mobile health etc. This lecture will also discuss how the flexible electronics research may unfold in the future.
Bio: Professor Ravinder DAHIYA, Bendable Electronics and Sensing Technologies (BEST) Group, School of Engineering, University of Glasgow, G12 8QQ, UK